Lot · Other Semiconductor & PCB Manufacturing
ASM DS898 Die Bonder
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Wed · May 20, 2026
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ZIP 226**
tryc2
103,924 ratings · 99.90% positive
Description
From the sellerSerial Number: DS898-43006-1. Other Features: Substrate Size: 120-200mm (length) x 50-90mm (width), High Throughput: Can reach speeds up to 600 strokes/minute (likely referring to the die-cutting unit).
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